| Type | Subject | Comments |
|---|
 | Panti Jomblo
Posted on Nov 9, '07 1:51 PM for everyone
" sudah lama gak nengok page ini... Barusan dapet link bagus dari friendster temen... isinya lucu. Jadinya bagus juga jadi bahan obrolan disini.... http://profiles.frie..."
| 4 |
| Strange Deja Vu
Posted on Sep 28, '07 10:41 PM for everyone
"seems like this song by Dream Theater is able to describe what I feel now.... Nicholas:Subconscious strange sensationUnconscious relaxationWhat a pleasant nightmareAnd I cant wait ..."
| 0 |
| LOOSING THE NEW SMART INDONESIAN GENERATION!!!!MIGRATING OVERSEAS.!!!!!
Posted on Aug 2, '07 1:18 PM for everyone
"Aug 2, '07 10:32 AMby tukiem for everyone taken from: http://indonesiancommunity.multiply.com/journal/item/1236?mark_read=indonesiancommunity:journal:1236 On Monday, June 7..."
| 1 |
| Obrolan Jomblo-ers
Posted on Jun 14, '07 11:53 AM for everyone
"Jomblo yah.... kata orang Jomblo itu sebuah pilihan. Kata orang jomblo juga merupakan sebuah konsekuensi logis dari diri. Berikut percakapan antara 2 joblo beberapa har..."
| 1 |
| Degree Audit ? ? ?
Posted on Jun 10, '07 7:55 PM for everyone
""Degree Audit" is one of the most important school-related data with high privacy for all NTU students. It documents all of the students' examination results from the first to fina..."
| 0 |
| FYP Selection
Posted on Jun 10, '07 7:33 PM for everyone
"FYP - Final Year Project. Di project yang ditawarkan special buat mechatronics stream School of Mechanical and Aerospace Engineering, almost all of the projects include software de..."
| 0 |
| Report
Posted on Jun 10, '07 4:01 AM for everyone
" School of Mechanical and Aerospace Engineering Report on Industrial Attachment With A*STAR Inst..."
| 0 |
| References
Posted on Jun 10, '07 3:56 AM for everyone
" References 1. Van Driel, W.D. Hochstenbach, H.P. Zhang, G.Q. “Design for Reliability of Wafer Level Packages”. Thermal, Mechanical and Mult..."
| 0 |
| Conclusion
Posted on Jun 10, '07 3:56 AM for everyone
" 6. Conclusion 6.1 Project Conclusion Most of the objectives in the project have been done through out the Industrial Attachment period. 3 different types of Underfills ..."
| 0 |
| Testing and Reliability Assessments
Posted on Jun 10, '07 3:55 AM for everyone
" 5. Testing and Reliability Assessments 5.1 Introduction In the last few years there has been a dramatic increase in the use of mechanical testing in the microelectronic..."
| 1 |
| Wettability Studies
Posted on Jun 10, '07 3:45 AM for everyone
" 4. Wettability Studies 4.1 Introduction Solder strength hold an important factor in the microelectronics device assembly. Mechanical shear strength and adhesive strengt..."
| 0 |
| Assembly Process Set Up for WLP
Posted on Jun 9, '07 11:12 AM for everyone
" 3. Assembly Process Set Up for WLP 3.1 Introduction 3.1.1 Cu / Low-k Wafer Level Package (WLP) The technological trends of microelectronics are mainly characterized by ..."
| 0 |
| No Flow Underfills Testing and Reliability
Posted on Jun 9, '07 10:55 AM for everyone
"2.1 Introduction 2.1.1 Background Flip chip Wafer Level Chip-Scale Packages (WL-CSPs) technologies has expanded rapidly, particularly in portable electronic products and currentl..."
| 0 |
| Introduction
Posted on Jun 9, '07 9:14 AM for everyone
" 1. Introduction 1.1 Industrial Attachment 1.1.1 Background Industrial Attachment (IA) is a compulsory module for Engineering Undergraduate Students of Nanyang Technologica..."
| 0 |
| Acknowledgement
Posted on Jun 9, '07 9:10 AM for everyone
"Acknowledgement The author would like to thank Dr. Zhang Xiaowu, the author’s IME supervisor for giving the opportunity to work in IME under his supervision. He is not only ..."
| 0 |
| Abstract
Posted on Jun 9, '07 9:04 AM for everyone
"Abstract Wafer Level Packages (WLPs) are one of the most advanced packaging concepts. It combines the advantages of flip chip with conventional surface mount technologies. I..."
| 0 |
